Packaging

Equipment of the INT for packaging of integrated circuits

Packaging of integrated circuits requires highest precision. Therefore our laboratory is equipped with appropriate technology for the assembly of printed circuit boards with SMD components.

Soldering workstation

  • Nano soldering station with microscope
  • heat plate
  • Hot air station
  • Fume extraction unit.

 

Soldering workstation with microscope
Soldering workstation with microscope

The assembly of printed circuit boards can be done manually or with the help of SMD mounter.

 SMD mounter
SMD mounter: Manual pick & place tool with support of a camera

The integrated circuits are usually glued for heat dissipation on a copper or brass plate and connected by means of bonding wires to a circuit board. The INT has corresponding bonding machines.

Bonding machines

The INT is equipped with

  • Wedge bonder
  • Ball bonder
  • Die bonder

for gold and aluminum wire.

Manual wedge bonder
Manual wedge bonder

Packaging examples

Example of a complex packaged integrated circuit. The IC is glued on a PCB and connected to the gold-plated board surface by gold bonding wires.

PC bonded on PCB
PC bonded on PCB

Example of a complete module with an integrated circuit. The IC is glued on a brass plate and connected to the gold-plated board surface by gold bonding wires.

Module: IC on a brass plate with RF-PCB
Module: IC on a brass plate with RF-PCB

Close-up view of the packaged integrated circuit. The chip is sunk in a cavity. As a result, shorter lengths of bonding wires can be achieved. Bonding capacitances are placed close to the chip, which should compensate for voltage fluctuations.

Detailed view of the module
Detailed view of the module

Contact

This picture showsThomas Veigel
Dr.-Ing.

Thomas Veigel

Research staff member

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