For configuration of integrated circuits single-board computers (e.g., Raspberry Pi) or simple FPGAs (e.g., Xilinx Spartan 3) are commonly used.
As an alternative to traditional metrology devices, FPGA development boards (eg, Xilinx Virtex-7, Virtex-6, and Virtex-4) are available with high-speed serial interfaces up to 28 Gbps per channel for both transmit and receive of data can be used. These channels can be grouped into multiple parallel interfaces.
Instead of the packaging on printed circuit boards, integrated circuits with only a few connection pads can be connected directly to the measurement environment by means of a wafer prober. The contacting of the IC is done via measuring tips, which are aligned by means of micrometer manipulators under a microscope. The advantages are that the parasitic influences of the measuring tips and cables are generally much lower than those of the bonding wires and printed circuit board. Thus, this technique is suitable to characterize circuits with highest bandwidths. Hybrid setups are also possible. In this case, the power supply connections and low frequency configuration signals are supplied via a printed circuit board, while high-frequency signals are tapped via measuring tips.
The INT has a specially shielded measuring cabin. Here, measurements can be done without external interference from microwave radiation (e.g., cellular, WLAN, etc.). The measuring cabine booth also shields to the outside so that internally generated microwave radiation e.g. has no influence on existing mobile networks.