Adaptive optical and microfluidic chip integration through 3D alignment structures
In the article “Adaptive optical and microfluidic chip integration through 3D alignment structures,” our researcher Rouven Klenk from INT presents new approaches to the integration of photonic and microfluidic chips.
The focus is on a flexible packaging approach using 3D-printed alignment structures, which enables precise and adaptable connections between different components. The results open up new possibilities for compact optofluidic systems and modern sensor applications.